The premier event in the rubber and plastics industry, Chinaplas exhibition 2025, is set to begin! As the world’s leading trade fair for plastics and rubber, CHINAPLAS exhibition continues to drive technological advancement, collaboration, and sustainable growth across the industry. This year’s theme, “Change, Collaboration, and Common Sustainability,” will bring together global industry leaders to showcase cutting-edge products, technologies, and solutions shaping the future of the sector.

Chinaplas exhibition informations:
 Date: April 15–18, 2025
Venue: Shenzhen World Exhibition & Convention Center (Baoan)
 Exhibition Space: 380,000 sqm
 Exhibitors: 4,500+ leading companies
Key Zones: 17 specialized theme areas covering:
Machinery & Equipment: Injection molding machines, molds, 3D printing, hot runners, and more
Materials & Additives: 3D printing materials, recycled plastics, engineering polymers, bioplastics, and sustainable solutions，etc.
 
We are proud to participate as an exhibitor at Chinaplas exhibition  2025 and invite you to connect with us at Booth 9H74.
 
As an exhibitor of Chinaplas exhibition, we sincerely invite you to visit booth 9H74 for communication. Our company--Langko Mould was established in 2016, we are a high-tech enterprise specializing in precision injection mold design and manufacturing. With a core team boasting 18+ years of industry expertise, we deliver excellence in the following fields:
✓ Automotive parts mould development
✓ Precision injection moulding of household products
✓ Customized solutions for industrial parts
✓ Application of 3D printing technology
Our core competitiveness
• A young and energetic R&D team with a team of experienced engineers
• One-stop service capabilities from design to mass production
• Strict quality control system
• Quick response customer service mechanism
 
Looking forward to discussing industry trends with you at booth 9H74 and creating opportunities for cooperation. If you need to make an appointment for negotiation, please feel free to contact us.